Production and Characterization of SAC-xAl Lead Free Nanocomposite ‎Solder via Melt-Spinning Technique

Document Type : Original Research Article

Authors

1 Materials Science and Engineering, Sharif University of Technology,Tehran, Iran

2 Materials Science and Engineering, Sharif University of Technology, Tehran, Iran

10.22034/frj.2018.121022.1032

Abstract

The aim of the present study is to produce Sn base lead-free nanocomposite solders reinforced by nanoparticles with rapid solidification technique and compare their mechanical, electrical and thermal properties with conventional SAC (Sn-3.8Ag-0.7Cu) solder. Therefore, four lead-free soldering alloys Sn-3.8Ag-0.7Cu-XAl (X = 0, 0.25, 0.5, 1) were alloyed using a vacuum arc remelting (VAR) furnace. Then with melt spinning technique ribbons of nanocomposite solders reinforced with Cu6Sn5 and Ag3Sn intermetallic compounds nanoparticle were manufactured. The microstructural, mechanical, electrical and thermal properties of these nanocomposite solders were investigated using scanning electron microscopy, X-ray diffraction, Vickers hardness method, four-point resistance measurement method and differential scanning calorimetry (DSC). The results showed the uniform distribution of nanoparticles intermetallic compounds Cu6Sn5 and Ag3Sn in the solder matrix and a 30% significant increase of micro-hardness, negligible variation in the specific electrical resistance, and a 3 degrees increase in the melting temperature of the new nanocomposite solder compared to conventional SAC solder.

Keywords

Main Subjects

References

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Founding Research Journal
Volume 1, Issue 3 - Serial Number 3
March 2018
Pages 171-180

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History

  • Receive Date: 04 March 2018
  • Revise Date: 10 April 2018
  • Accept Date: 11 April 2018

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