عنوان مقاله [English]
The aim of the present study is to produce Sn base lead-free nanocomposite solders reinforced by nanoparticles with rapid solidification technique and compare their mechanical, electrical and thermal properties with conventional SAC (Sn-3.8Ag-0.7Cu) solder. Therefore, four lead-free soldering alloys Sn-3.8Ag-0.7Cu-XAl (X = 0, 0.25, 0.5, 1) were alloyed using a vacuum arc remelting (VAR) furnace. Then with melt spinning technique ribbons of nanocomposite solders reinforced with Cu6Sn5 and Ag3Sn intermetallic compounds nanoparticle were manufactured. The microstructural, mechanical, electrical and thermal properties of these nanocomposite solders were investigated using scanning electron microscopy, X-ray diffraction, Vickers hardness method, four-point resistance measurement method and differential scanning calorimetry (DSC). The results showed the uniform distribution of nanoparticles intermetallic compounds Cu6Sn5 and Ag3Sn in the solder matrix and a 30% significant increase of micro-hardness, negligible variation in the specific electrical resistance, and a 3 degrees increase in the melting temperature of the new nanocomposite solder compared to conventional SAC solder.
 M. Sona, K. N. Prabhu, Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints, Journal of Materials Science: Materials in Electronics, 2013, 24(9) 3149–3169.
 D. Q. Yu, H. P. Xie, L. Wang, Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate, Journal of Alloys and Compounds, 2004, 385(1–2) 119–125.
 H. Ma, J. C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. Journal of Materials Science, 2009, 44(5) 1141–1158.
 E. E. Mhd-Noor, A. Singh, Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys, Soldering & Surface Mount Technology, 2014, 26(3) 147–161.
 E. E. Mhd Noor, N. F. Mhd Nasir, S. R. A. Idris, A review: lead free solder and its wettability properties, Soldering & Surface Mount Technology, 2016, 28(3) 125–132.
 P. Liu, P. Yao, and J. Liu, Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy, Journal of Electronic Materials, 2008, 37(6) 874–879.
 T. H. Chuang, M. W. Wu, S. Y. Chang, S. F. Ping, L. C. Tsao, Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder, Journal of Materials Science: Materials in Electronics, 2011, 22(8) 1021–1027.
 L. C. Tsao, R. W. Wu, T. H. Cheng, K. H. Fan, R. S. Chen, Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads, Materials & Design, 2013, 50 774–781.
 Tai F., et al., Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions, Journal of Electronic Materials, 2005, 34(11) 1357–1362.
 S. T. Kao, Y. C. Lin, and J. G. Duh, Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition, Journal of Electronic Materials, 2006, 35(3) 486–493.
 Y. Shi et al., Creep properties of composite solders reinforced with nano- and microsized particles, Journal of Electronic Materials, 2008, 37(4) 507–514.
 J. Shen, Y. C. Liu, Y. J. Han, Y. M. Tian, and H. X. Gao, Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder Journal of Electronic Materials, 2006, 35(8) 1672–1679.
 J. Shen and Y. C. Chan, Research advances in nano-composite solders, Microelectronics Reliability, 2009, 49(3) 223–234.
 J. H. Lee, D. J. Park, J. N. Heo, Y. H. Lee, D. H. Shin, and Y. S. Kim, Reflow characteristics of Sn-Ag matrix in-situ composite solders, Scripta Materialia, 2000, 42(8) 827–831.
 J. Shen, Y. C. Liu, H. X. Gao, In situ nanoparticulate-reinforced lead-free Sn–Ag composite prepared by rapid solidification, Journal of Materials Science: Materials in Electronics, 2007, 18, 463–468.
 R. M. Shalaby, Indium, chromium and nickel-modified eutectic Sn–0.7 wt% Cu lead-free solder rapidly solidified from molten state, Journal of Materials Science: Materials in Electronics, 2015, 26(9) 6625–6632.
 R. M. Shalaby et al, Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt, Journal of Advances in Physics, 2015, 10(1) 2641–2648.
 J. F. Li, P. A. Agyakwa, C. M. Johnson, Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate, Journal of Alloys and Compounds, 2012, 545 70–79.
 A. J. Boesenberg, I. E. Anderson, and J. L. Harringa, Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al, Journal of Electronic Materials, 2012, 41(7) 1868–1881.
 R. R. Chromik, R. P. Vinci, S. L. Allen, M. R. Notis, Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation, Journal of the Minerals, Metals & Materials Society (TMS), 2003, 55(6) 66–69.
 Dutta I, Park C, Choi S, Impression creep characterization of rapidly cooled Sn–3.5Ag solders, Materials Science and Engineering: A, 2004, 379(1-2) 401–410.
 P. Babaghorbani, S. M. L. Nai, M. Gupta, Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders, Journal of Alloys and Compounds, 2009, 478(1-2) 458–461.
 Chen G., Wu F., Liu C., Chan Y.C., Effect of Fullerene-C60 & C70 on the Microstructure and Properties of 96.5Sn-3Ag-0.5Cu Solder a b, Electronic Components & Technology Conference, 2015, 1262–1267.
 Nai S.M.L., Wei J., Gupta M., Effect of carbon nanotubes on the shear Strength and electrical resistivity of a lead-free solder, Journal of Electronic Materials, 2008, 37(4) 515–522.